Author(s): Sarawut Rimdusit and Isala Dueramae

Year: 2014

Benzoxazine resins are highly attractive for applications that include composite parts in aircraft1and electronic packaging. These resins are a novel class of thermosetting polymers that combine the thermal properties and flame retardance of phenolic resins with the excellent mechanical performance and molecular design flexibility of epoxy resins. However, the inherent rigidity of benzoxazines can be limiting. Researchers in this field are currently working to widen the applications of these polymers through greater flexibility.

Polybenzoxazines are a class of macromolecules that possess nitrogen and oxygen in a cyclic molecular structure that is fused to another benzene ring. During polymerization, polybenzoxazines demonstrate several advantageous characteristics, including catalysis-free curing, near-zero shrinkage (which improves dimensional stability), and a byproduct-free curing process. Finished polybenzoxazines also demonstrate low melt viscosity, high glass-transition temperature (Tg), high thermal stability, good mechanical strength and modulus, low water absorption, low dielectric constant, good adhesive properties, and high resistance to burning and chemical degradation. Consequently, a number of companies have commercialized the resins and their composites.


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Modified resin for high-performance composites