Tuesday,
May 9
8 a.m.-11 a.m.
Charlotte Convention Center
Polymer
Surfaces at the Nanoscale
The promise of nanotechnology is immense and
multifaceted. Within the scientific community,
considerable effort is being directed towards
understanding the physical and chemical properties
of interfaces and the surfaces of materials,
including polymers at the nanoscale for applications
in micro/nanoelectronics, biotechnology, and
integrated optics (among others).
As an example, the continued demand for smaller
form factors with multiple functionality in
products, coupled with the explosive interest
in nanotechnology, has allowed for research
and development to produce unique behaviors
and discoveries only observable at the nanoscale.
This New Technology Forum will present the current
landscape of the latest developments in the
area of nanostructured polymeric materials and
its modification, manipulation, and characterization
at the nanoscale either at the surface or interface.
| 8 a.m |
Martin Guthold, Wake Forest
University |
Viscoelastic
Properties of Single Fibrin Fibers: |
| 8:30 a.m. |
Douglas Irving, North Carolina
State University |
Tribological Simulation:
Surface Treatments and Techniques: |
| 9 a.m. |
James Batteas, Texas A&M University |
Nanopatterning of Surfaces: |
| 9:30 a.m |
Alamgir Karim, NIST |
Strategies for Manipulating Block-Copolymer
Thin Film Structure: |
| 10 a.m. |
John Marohn, Cornell University |
Ultrasensitive Nuclear Magnetic
Resonance by Mechanical Detection: |
| 10:30 a.m. |
Jayesh Doshi, eSPIN Technologies |
Polymer Nanofiber Processing
and Applications of Nanofiber: |
2:00
p.m.-6 p.m.
Charlotte Convention Center
Active
and Intelligent Packaging
Co-sponsored the
SPE New Technology Committee and Flexible Packaging
Division
The Flexible Packaging Division and New Technology
Committee of SPE are co-sponsoring a session
which will focus on the latest technical advancements
in active and intelligent packaging.
This session will include a general overview
of active and intelligent packaging, as well
as the latest developments within the field.
The selected presenters include leading researchers
from academia, raw material suppliers, converters
and government agencies. This session will interest
researchers throughout the packaging supply
chain, from raw material producers to end-users.
Topics include: active sealant layers, sensory
enhancers, migration and transmission control
through novel polymer chemistry, biocides, and
the latest developments in additives for active
and intelligent packaging.
| 2:00 p.m. |
Kay Cooksey,
Clemson University |
General Overview
of Active Intelligent Packaging: |
| 2:30 p.m. |
Raymond Clarke, Apio |
The Challenges in Packaging
Fresh Produce |
| 3:00 p.m. |
Billy Abrams, CSP Technologies |
Co-Continuous Channel Structure
within a Polymer Matrix |
| 3:30 p.m. |
Vivek Chougule, Pliant Corporation |
Controlled Release Active
Packaging by Polymer Blending |
| 4:00 p.m. |
Dr. Tom Yang, Natick Soldier
Systems |
Active Packaging Applications
for Military Rations - An End User's Perspective |
