Carbon
Nanotubes in Polymers
Monday, May 7
1:30 p.m.-5 p.m.
Duke Energy Center
Moderator:
Brian Grady, Oklahoma University
Carbon nanotubes have excellent mechanical
properties and high thermal and electrical conductivities
making them ideal fillers for polymers in some
applications. This forum brings together leaders
in the field of carbon nanotubes/polymer composites
to discuss the history and current understanding
of how carbon nanotubes behave as fillers in
polymers. The uniqueness of carbon nanotubes
as compared to other fillers will be highlighted.
Technical and economic challenges that must
be overcome to expand the use of carbon nanotubes
in polymers will also both be discussed in this
forum.
Presentations include:
| Time |
Title
|
Contact
Name |
Affiliation |
| 1:30 p.m. |
An Introduction to Carbon Nanotubes in
Polymers |
Brian Grady |
University of Oklahoma |
| 2 p.m. |
Melt Processing of Multiwalled
Carbon Nanotube-Polymer Composites |
Petra Poetschke |
Leibniz-Institut fuer Polymerforschung
Dresden |
| 2:30 p.m. |
Polymer Nanocomposites Containing Carbon
Nanotubes: Flammability, Electrical, and
Thermal Conductivity
|
Mohammad Moniruzzaman |
University of Pennsylvania |
| 3 p.m. |
Mechanical Properties of Polymer-Nanotube
Composite Materials: Inverse Composites
to Fibers |
Jonathan Coleman |
University College: Dublin |
| 3:30 p.m. |
Commercial Applications for Multi-Walled
Carbon Nanotubes in Polymers |
Timothy Jozokos |
Hyperion Catalysis |
| 4 p.m. |
Panel Discussion |
|
|
Sponsored by: 
New
Developments in Active and Intelligent Packaging
Tuesday, May 8
1:30 p.m.-4:30 p.m.
Duke Energy Center
Moderators:
Ryan Breese, Eclipse Film Technologies and Maggie
Baumann, G H Associates
The field of active and intelligent packaging
has generated a great amount of excitement in
the polymer industry. Active and intelligent
packaging is a broad field, which includes both
rigid applications, such as beverage containers,
and flexible applications, such as films for
food packaging. In addition, newer fields of
polymer science, such as nanocomposite and biomaterial
science can be combined with traditional packaging
science to provide insight into advanced development
programs that will provide unique products in
the future. The purpose of this session is to
present new discoveries in materials science
and demonstrate their advantages in a wide variety
of packaging applications and to inspire the
rethinking of today's packaging technology.
| Time |
Title
|
Contact
Name |
Affiliation |
| 1:30 pm |
Materials Chemistry for Printed
Electronics Applications
|
Elsa Reichmanis |
Bell Labs, Lucent Technologies |
| 2:00 pm |
Functional Films for Intelligent
Packaging
|
Ramesh Pisipati, Ph.D. |
Bayer MaterialScience LLC |
| Dr. Daniel Rudhardt |
Bayer MaterialScience AG |
| 2:30 pm |
Getter Materials for Quasi-hermetic Electronic
Packaging Applications
|
Gene Kim, Ph.D. |
Cookson Electronics Semiconductor
Products |
| 3:00 pm |
A Technology Look into the
Future (RFID, SRA, Mobile Computing, Crisis
Management)
|
Wayne Smouse |
Penn State University |
| 3:30 pm |
Polymer Technologies in RFID and Other
Electronics Packaging Applications |
|
|
| 4:00 pm |
Panel Discussion |
|
|
|
