Epoxy Adhesive Formulations

Since the first introduction of epoxy resins in 1946, adhesive bonding has been one of the most valuable uses for such resins. The scope and versatility of these resins offer a number of advantages. These include ease of application, low cure temperature, low cure pressure, and high strength. As a result, many consider epoxy adhesive to the “workhorse” of structure adhesives. The purpose of this seminar is to provide an understanding of epoxy adhesive technology for those starting out in this area or for those who are more experienced and require a “refresher” and update. The webinar will provide answers to many questions that engineers, chemists, or businessmen may have about epoxy adhesives. What is the chemistry and the base materials used in epoxy resins formulations? How do selective formulations control the processing and end properties? What are the significant variables in epoxy resin adhesive formulation and application? What are the mechanisms of adhesion? How do epoxy adhesives respond to various environmental factors including stress, impact, temperature, moisture, and chemicals? What new materials and applications are available to the formulator and end-user? The major materials and formulations used in epoxy adhesive will be reviewed along with their chemistries. Formulation, processing and performance characteristics will be defined. Several applications where epoxies provide a distinct advantage over other structural adhesives will be analyzed and potential “problem areas” will be discussed.

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