Presented by: Jim Schmitz, Wittmann Inc., April 17, 2008
$99.00
Interest and applications for In-Mold Labeling (IML), which is primarily used for packaging applications, are rapidly increasingly in the U.S., although it has been well established in Europe for many years. There are several technical considerations in terms of the label, mold, automation, and machine, but the process can be quite cost-effective for the small or large processor because of the flexibility the technology offers. This presentation will examine the various requirements and options for IML for a range of molded products and will include discussion about the key system components. Examples of actual IML applications will be used to demonstrate the ease-of-use and reliability today’s technology offers.
