9/28/2010
7,803,307
Ultra high-temperature plastic package and method of manufacture
Zimmerman of Interplex QIP has developed a package for microelectronics based on injection molding a liquid crystal polymer into a flange or lead frame.  After molding, secondary polymerization is initiated by heating resulting in a ultra-high molecular weight liquid crystal polymer that can be soldered to the flange.   (RDC 12/8/2010)