Ultrasonic assisted Adhesive Bonding
Ultrasonic energy (e.g., ultrasonic vibration) can assist conventional adhesive bonding. Siavoshani and Mahdi have developed a method based on attaching surfaces with an adhesive and, then, applying ultrasonic energy to the unit. This method is effective in assisting adhesive bonding in different circumstances in relatively short periods of time. In addition it can quickly improve adhesive bonding. (Siavoshani and Mahdi, US Patent 7,842,146; 11/30/2010)
Recent US Patents
11/30/2011
7,842,146
Ultrasonic energy for adhesive bonding
Siavoshani and Mahdi of Dow, Michigan found that ultrasonic can enhance adhesive bonding especially reduced bonding time. The ultrasonic energy, particularly ultrasonic vibrations, can assist the adhesive in wetting the substrate surface, curing, polymerization or the like to enhance bonding. (RDC 4/18/2011)