Contents Include:
Technology Trends in Portable Wireless Products and Wireless Networks; Helping Plastic Optical Fiber Challenge the Performance of Glass and the Simplicity of Use of Wire; Molded Interconnect Devices; Thin Wall Molding of Engineering Resins; A New Solution Focus on Molding Quality and Optimization; Prototype vs. Production Tooling in Rapid Product Development; Using Conductive Adhesives for Grounding Applications; Liquid Crystal Polymer Laminates for Wireless Applications.